Annual Review of Heat Transfer: Volume 18: Thermal Management Fundamentals Technologies (Hardback)
5 Angebote vergleichen
Bester Preis: € 191,68 (vom 07.08.2017)1
Annual Review of Heat Transfer: Volume 18: Thermal Management Fundamentals and Technologies (2016)
EN HC USISBN: 9781567004496 bzw. 1567004490, Band: 18, in Englisch, 277 Seiten, Begell House Publishers Inc.,U.S. gebundenes Buch, gebraucht.
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, Wordery USA.
Significant advancements in thermal management technologies have been made in recent years for defense, commercial, and space systems. This volume summarizes important progress in addressing challenges for electronics cooling ranging from near the junction of the device to the system level. This chapter provides an introduction and overview of this volume. The first chapter examines GaN composite substrates for near junction thermal management of high power, wide band gap power amplifiers. The next chapter discusses opportunities in nanostructured thermal interface materials. The following chapter presents recent developments in thermal ground planes as heat spreaders. The subsequent four chapters focus on active cooling approaches including one on single-phase liquid flow, one for three-dimensional integrated circuits, one on flow control of two-phase microchannel cooling systems, and one on thermo-electrics for hotspot cooling. The last chapter discusses thermal management in LED packaging. Hardcover, Label: Begell House Publishers Inc.,U.S. Begell House Publishers Inc.,U.S. Product group: Book, Published: 2016-07-30, Studio: Begell House Publishers Inc.,U.S.
Von Händler/Antiquariat, Wordery USA.
Significant advancements in thermal management technologies have been made in recent years for defense, commercial, and space systems. This volume summarizes important progress in addressing challenges for electronics cooling ranging from near the junction of the device to the system level. This chapter provides an introduction and overview of this volume. The first chapter examines GaN composite substrates for near junction thermal management of high power, wide band gap power amplifiers. The next chapter discusses opportunities in nanostructured thermal interface materials. The following chapter presents recent developments in thermal ground planes as heat spreaders. The subsequent four chapters focus on active cooling approaches including one on single-phase liquid flow, one for three-dimensional integrated circuits, one on flow control of two-phase microchannel cooling systems, and one on thermo-electrics for hotspot cooling. The last chapter discusses thermal management in LED packaging. Hardcover, Label: Begell House Publishers Inc.,U.S. Begell House Publishers Inc.,U.S. Product group: Book, Published: 2016-07-30, Studio: Begell House Publishers Inc.,U.S.
2
Annual Review of Heat Transfer: Volume 18: Thermal Management Fundamentals and Technologies (Hardback) (2016)
EN HC NWISBN: 9781567004496 bzw. 1567004490, Band: 18, in Englisch, Begell House Publishers Inc.,U.S., United States, gebundenes Buch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Free shipping.
Von Händler/Antiquariat, The Book Depository [54837791], London, United Kingdom.
Language: N/A. Brand New Book. Significant advancements in thermal management technologies have been made in recent years for defense, commercial, and space systems. This volume summarizes important progress in addressing challenges for electronics cooling ranging from near the junction of the device to the system level. This chapter provides an introduction and overview of this volume. The first chapter examines GaN composite substrates for near junction thermal management of high power, wide band gap power amplifiers. The next chapter discusses opportunities in nanostructured thermal interface materials. The following chapter presents recent developments in thermal ground planes as heat spreaders. The subsequent four chapters focus on active cooling approaches including one on single-phase liquid flow, one for three-dimensional integrated circuits, one on flow control of two-phase microchannel cooling systems, and one on thermo-electrics for hotspot cooling. The last chapter discusses thermal management in LED packaging.
Von Händler/Antiquariat, The Book Depository [54837791], London, United Kingdom.
Language: N/A. Brand New Book. Significant advancements in thermal management technologies have been made in recent years for defense, commercial, and space systems. This volume summarizes important progress in addressing challenges for electronics cooling ranging from near the junction of the device to the system level. This chapter provides an introduction and overview of this volume. The first chapter examines GaN composite substrates for near junction thermal management of high power, wide band gap power amplifiers. The next chapter discusses opportunities in nanostructured thermal interface materials. The following chapter presents recent developments in thermal ground planes as heat spreaders. The subsequent four chapters focus on active cooling approaches including one on single-phase liquid flow, one for three-dimensional integrated circuits, one on flow control of two-phase microchannel cooling systems, and one on thermo-electrics for hotspot cooling. The last chapter discusses thermal management in LED packaging.
3
Annual Review of Heat Transfer: Volume 18 (2016)
EN NWISBN: 9781567004496 bzw. 1567004490, Band: 18, in Englisch, Begell House Publishers Inc.,U.S. neu.
Von Händler/Antiquariat, Books2Anywhere [190245], Fairford, GLOS, United Kingdom.
New Book. Shipped from UK in 4 to 14 days. Established seller since 2000.
New Book. Shipped from UK in 4 to 14 days. Established seller since 2000.
4
Chen, Gang (Editor-in-chief), and Prasad, Vishwanath (Editor-in-chief), and Jaluria, Yogesh (Editor-in-chief)
Annual Review of Heat Transfer: Volume 18: Thermal Management Fundamentals Technologies (2016)
EN HC NWISBN: 9781567004496 bzw. 1567004490, Band: 18, in Englisch, Begell House Publishers Inc.,U.S. gebundenes Buch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, plus shipping, Shipping area: EUR.
Von Händler/Antiquariat, The Saint Bookstore, MERSEYSIDE, Southport, [RE:4].
Hard cover.
Von Händler/Antiquariat, The Saint Bookstore, MERSEYSIDE, Southport, [RE:4].
Hard cover.
5
Annual Review of Heat Transfer: Volume 18
EN HC NWISBN: 9781567004496 bzw. 1567004490, Band: 18, in Englisch, Begell House Publishers Inc., U. S, gebundenes Buch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, plus shipping, Shipping area: EUR.
Von Händler/Antiquariat, Books2anywhere, GLOUCESTERSHIRE, Fairford, [RE:4].
Hardcover.
Von Händler/Antiquariat, Books2anywhere, GLOUCESTERSHIRE, Fairford, [RE:4].
Hardcover.
Lade…