Thick Film Technology and Chip Joining. Processes and Materials in Electronics a Series of Monographs, Texts, and Reference Books Covering Areas and Topics of Current Interest in Electronics. Volume I
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Bester Preis: 4,65 (vom 29.11.2016)
1
Miller, Lewis F.

Thick Film Technology and Chip Joining (1972)

Lieferung erfolgt aus/von: Vereinigtes Königreich Großbritannien und Nordirland EN HC US

ISBN: 9780677034409 bzw. 0677034407, in Englisch, Gordon and Breach, gebundenes Buch, gebraucht.

12,39 ($ 13,12)¹ + Versand: 8,43 ($ 8,93)¹ = 20,82 ($ 22,05)¹
unverbindlich
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Versandkosten nach: USA.
Von Händler/Antiquariat, PsychoBabel & Skoob Books.
New York, London, Paris: Gordon and Breach, 1972. No dust jacket. Hardcover. Ex-Library. Library label on front pastedown. Library stamps on front pastedown and title page. Boards have some edge-wear. Bump on upper edge of front board. Spine is cocked, worn and rubbed. Spine ends are bumped. Leading corners are worn and rubbed. Binding is sound. Contents are clear. AF. Hardcover. Good/No Dust Jacket. Ex-Library.
2
Miller, Lewis F.

Thick Film Technology and Chip Joining (1972)

Lieferung erfolgt aus/von: Vereinigtes Königreich Großbritannien und Nordirland EN HC US

ISBN: 9780677034409 bzw. 0677034407, in Englisch, Gordon and Breach, New York, London, Paris, gebundenes Buch, gebraucht.

12,42 ($ 13,15)¹ + Versand: 5,85 ($ 6,20)¹ = 18,27 ($ 19,35)¹
unverbindlich
Von Händler/Antiquariat, PsychoBabel & Skoob Books [2917279], Didcot, OXON, United Kingdom.
No dust jacket. Hardcover. Ex-Library. Library label on front pastedown. Library stamps on front pastedown and title page. Boards have some edge-wear. Bump on upper edge of front board. Spine is cocked, worn and rubbed. Spine ends are bumped. Leading corners are worn and rubbed. Binding is sound. Contents are clear. AF.
3
Lewis F. Miller

Thick Film Technology and Chip Joining (1972)

Lieferung erfolgt aus/von: Vereinigtes Königreich Großbritannien und Nordirland EN HC US FE

ISBN: 9780677034409 bzw. 0677034407, in Englisch, Gordon and Breach, New York, gebundenes Buch, gebraucht, Erstausgabe, mit Einband.

16,30 ($ 17,26)¹ + Versand: 9,96 ($ 10,55)¹ = 26,26 ($ 27,81)¹
unverbindlich
Von Händler/Antiquariat, Rivermead Books [54510841], Southampton., United Kingdom.
VG/Good, dark grey dj in transparent dw and with white titles on tarnished spine, ex-Royal Aircraft Establishment Library, contents are clean and unmarked, octavo 221pp. Weight 650g. Screening and paste transfer; thin film conductors; silver palladium electrodes; ternary alloy electrodes; glaze restore; controlled collapse reflow chip joining; chip joining technique; powder interconnections.
4
Miller, Lewis F.

Thick Film Technology and Chip Joining. Processes and Materials in Electronics a Series of Monographs, Texts, and Reference Books Covering Areas and Topics of Current Interest in Electronics. Volume I (1972)

Lieferung erfolgt aus/von: Vereinigte Staaten von Amerika EN HC US

ISBN: 9780677034409 bzw. 0677034407, Band: 1, in Englisch, Gordon & Breach, gebundenes Buch, gebraucht.

5,57 ($ 5,90)¹ + Versand: 3,31 ($ 3,50)¹ = 8,88 ($ 9,40)¹
unverbindlich
Von Händler/Antiquariat, Zubal-Books [581], Cleveland, OH, U.S.A.
221 pp., hardcover, ex library, wear to extremities, else text clean and binding tight.
5
Miller, L.

Thick Film Technology and Chip Joining (1972)

Lieferung erfolgt aus/von: Vereinigte Staaten von Amerika EN HC NW FE

ISBN: 9780677034409 bzw. 0677034407, in Englisch, Williston, Vermont, U.S.A.: Gordon & Breach Science Pub, gebundenes Buch, neu, Erstausgabe, mit Einband.

33,05 ($ 35,00)¹ + Versand: 5,67 ($ 6,00)¹ = 38,72 ($ 41,00)¹
unverbindlich
Von Händler/Antiquariat, Eugene M. Tropp-Technical Books [465183], Beaverton, OR, U.S.A.
Hardback, 1st Edition 1972, 221 Pages, Book Condition NEW, Dust Jacket NEW.
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