Surface Mount Technology with Fine Pitch Components: The Manufacturing Issues (Hardback)
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| Preise | 2011 | 2013 | 2014 | 2015 | 2017 |
|---|---|---|---|---|---|
| Schnitt | € 161,16 | € 90,91 | € 133,43 | € 147,78 | € 132,16 |
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1
Surface Mount Technology with Fine Pitch Components
EN HC NWISBN: 9780412553400 bzw. 0412553406, in Englisch, Springer, Berlin, gebundenes Buch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
buecher.de GmbH & Co. KG, [1].
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.X, 242 S.Versandfertig in 3-5 Tagen, Hardcover.
buecher.de GmbH & Co. KG, [1].
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.X, 242 S.Versandfertig in 3-5 Tagen, Hardcover.
2
Surface Mount Technology with Fine Pitch Components (1994)
EN PBISBN: 9780412553400 bzw. 0412553406, in Englisch, Chapman & Hall, Vereinigtes Königreich Großbritannien und Nordirland, Taschenbuch.
Lieferung aus: Vereinigte Staaten von Amerika, Versandkostenfrei.
Von Händler/Antiquariat, Book Deals [60506629], Lewiston, NY, U.S.A.
This Book is in Good Condition. Clean Copy With Light Amount of Wear. 100% Guaranteed. Summary: Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.
Von Händler/Antiquariat, Book Deals [60506629], Lewiston, NY, U.S.A.
This Book is in Good Condition. Clean Copy With Light Amount of Wear. 100% Guaranteed. Summary: Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.
3
Surface Mount Technology with Fine Pitch Components: The Manufacturing Issues
ENISBN: 9780412553400 bzw. 0412553406, in Englisch, Springer.
Lieferung aus: Vereinigte Staaten von Amerika, En Stock.
Surface Mount Technology with Fine Pitch Components: The Manufacturing Issues Danielsson, Hans / Danielsson, H. This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
Surface Mount Technology with Fine Pitch Components: The Manufacturing Issues Danielsson, Hans / Danielsson, H. This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
4
Surface Mount Technology with Fine Pitch Components (1994)
EN NWISBN: 9780412553400 bzw. 0412553406, in Englisch, Springer, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Grünesbuch.de, [4519592].
Neuware - This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved. - - Besorgungstitel - vorauss. Lieferzeit 3-5 Tage. Buch.
Grünesbuch.de, [4519592].
Neuware - This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved. - - Besorgungstitel - vorauss. Lieferzeit 3-5 Tage. Buch.
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