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100%: Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein: Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3) (ISBN: 9780412084614) Springer Shop, 2. Ausgabe, in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
37%: R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein: Microelectronics Packaging Handbook, Part I: Technology Drivers (Microelectronics Packaging Handbook) (ISBN: 9780412084317) 1997, 2. Ausgabe, in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)
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Bester Preis: € 364,91 (vom 14.11.2016)1
Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1) (1997)
EN HC NWISBN: 9780412084317 bzw. 0412084317, in Englisch, 720 Seiten, 2. Ausgabe, Springer, gebundenes Buch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, Stork Group.
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. Hardcover, Ausgabe: 2nd, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 1997-01-31, Studio: Springer, Verkaufsrang: 2585611.
Von Händler/Antiquariat, Stork Group.
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. Hardcover, Ausgabe: 2nd, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 1997-01-31, Studio: Springer, Verkaufsrang: 2585611.
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Microelectronics Packaging Handbook, Part I: Technology Drivers (Microelectronics Packaging Handbook)
EN USISBN: 0412084317 bzw. 9780412084317, in Englisch, Springer, gebraucht.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
algorithms,computer science,computers and technology,design and architecture,education and reference,electrical and electronics,engineering,industrial manufacturing and operational systems,microprocessor design,microprocessors and system design, Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1), Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool- ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
algorithms,computer science,computers and technology,design and architecture,education and reference,electrical and electronics,engineering,industrial manufacturing and operational systems,microprocessor design,microprocessors and system design, Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1), Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool- ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
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Microelectronics Packaging Handbook, 3-part set. Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (1997)
EN NWISBN: 9780412084614 bzw. 0412084619, in Englisch, Springer, neu.
Von Händler/Antiquariat, Herb Tandree Philosophy Books [17426], Stroud, GLOS, United Kingdom.
9780412084614 This listing is a new book, a title currently in-print which we order directly and immediately from the publisher.
9780412084614 This listing is a new book, a title currently in-print which we order directly and immediately from the publisher.
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Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1)
EN HC USISBN: 9780412084317 bzw. 0412084317, in Englisch, Springer, gebundenes Buch, gebraucht.
Lieferung aus: Vereinigte Staaten von Amerika, Costurile de transport maritim: MDA.
Von Händler/Antiquariat, Discover Books.
Springer. Hardcover. GOOD. Gently used may contain ex-library markings, possibly has some light highlighting, textual notations, and or underlining. Text is still easily readable.
Von Händler/Antiquariat, Discover Books.
Springer. Hardcover. GOOD. Gently used may contain ex-library markings, possibly has some light highlighting, textual notations, and or underlining. Text is still easily readable.
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Microelectronics Packaging Handbook, 3-part set (2000)
~EN NWISBN: 9780412084614 bzw. 0412084619, vermutlich in Englisch, Springer Shop, neu.
Lieferung aus: Deutschland, Lagernd.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Special type.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Special type.
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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3) (1997)
EN PB NWISBN: 9780412084614 bzw. 0412084619, in Englisch, 3000 Seiten, 2. Ausgabe, Springer, Taschenbuch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days.
Von Händler/Antiquariat, affordable2015.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Paperback, Ausgabe: 2nd, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 1997-01-31, Studio: Springer, Verkaufsrang: 17277050.
Von Händler/Antiquariat, affordable2015.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Paperback, Ausgabe: 2nd, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 1997-01-31, Studio: Springer, Verkaufsrang: 17277050.
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MICROELECTRONICS PACKAGING HANDBOOK. Part 1, technology drivers, 2nd edition, édition en anglais (1997)
EN USISBN: 9780412084317 bzw. 0412084317, in Englisch, 720 Seiten, 2. Ausgabe, Chapman and Hall, gebraucht.
Nou de la: € 258,78 (4 Oferte)
Utilizat la: € 51,52 (7 Oferte)
Arată mai multe 11 Oferte de la Amazon.fr
Lieferung aus: Frankreich, Expédition sous 1 à 2 jours ouvrés.
Von Händler/Antiquariat, welcomebackbooks_usa.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, welcomebackbooks_usa.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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Microelectronics Packaging Handbook, 3-Part Set. Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (1997)
EN HC NWISBN: 9780412084614 bzw. 0412084619, in Englisch, 2. Ausgabe, Springer, gebundenes Buch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, zzgl. Versandkosten, Verandgebiet: EUR.
Von Händler/Antiquariat, Herb Tandree Philosophy Books, Stroud, Glos, [RE:4].
Special type, 2nd 1997 ed.
Von Händler/Antiquariat, Herb Tandree Philosophy Books, Stroud, Glos, [RE:4].
Special type, 2nd 1997 ed.
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Microelectronics Packaging Handbook: Technology Drivers Part I (1997)
EN HC NWISBN: 9780412084317 bzw. 0412084317, in Englisch, 720 Seiten, 2. Ausgabe, Springer, gebundenes Buch, neu.
Lieferung aus: Kanada, Usually ships within 1 - 2 business days.
Von Händler/Antiquariat, Daily-Deal-.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, Daily-Deal-.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
10
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem P
EN PB NWISBN: 9780412084614 bzw. 0412084619, in Englisch, Springer US, Taschenbuch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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