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100%: Subramanian, K. N.: Lead-Free Electronic Solders - A Special Issue of the Journal of Materials Science: Materials in Electronics (ISBN: 9780387484334) 2007, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
69%: Subramanian, Kv; Subramanian, Kn and Subramanian, K. N.: Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics (Hardcover) (ISBN: 9780387484310) in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
Lead-Free Electronic Solders - A Special Issue of the Journal of Materials Science: Materials in Electronics
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| Schnitt | € 181,99 | € 181,85 | € 181,85 | € 166,92 |
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LEAD-FREE ELECTRONIC SOLDERS: A SPECIAL ISSUE OF THE JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (2007)
EN HCISBN: 9780387484310 bzw. 0387484310, in Englisch, SPRINGER, gebundenes Buch.
Lieferung aus: Vereinigte Staaten von Amerika, Versandkostenfrei.
Von Händler/Antiquariat, Book Deals [60506629], Lewiston, NY, U.S.A.
This Book is in Good Condition. Clean Copy With Light Amount of Wear. 100% Guaranteed. Summary: Thermodynamics and Phase Diagrams of Lead-Free Solder Materials.- Phase Diagrams of Pb-Free Solders and their Related Materials Systems.- The Effects of Suppressed Beta Tin Nucleation on the Microstructural Evolution of Lead-Free Solder Joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-free Electronic Solder Applications.- Rare Earth Additions to Lead-Free electronic solders.- Compression Stress-Strain and Creep Properties of the 52In-48Sn and 97In-3Ag Low Temperature Pb-Free Solders.- Sn-Zn Low Temperature Solders.- Composite Lead-Free Electronic Solders.- Processing and Material Processing Issues Related to Lead-free Soldering.- Interfacial Reaction Issues for Lead-Free Electronic Solders.- Deformation Behavior of Tin and some Tin Alloys.- Microstructure-Based Modeling of Deformation in Sn-Rich (Pb-free) Solder Alloys.- Mechanical Fatigue of Sn-rich Pb-free Solder Alloys.- Life Expectancies of Pb-free SAC Solder Interconnects in Electronic Hardware.- Studies dealing with Sn-based solder joint behavior under thermal excursions encountered in service environments.- Electromigration Statistics and Damage Evolution for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages.- Electomigration Issues in Lead-Free Solder Joints.- Stress Analysis of Spontaneous Sn Whisker Growth.- Whisker Growth Issues.- Tin Pest Issues in Lead-Free Electronic Solders.- Issues Related to the Implementation of Pb-free Electronic Solders in Consumer Electronics.- Impact of the ROHS Directive on High Performance Electronic Systems: Part I-Need for Lead Utilization in Exempt Systems, Part II-Key Reliability issues Preventing the Implementation of Lead-Free Solders.
Von Händler/Antiquariat, Book Deals [60506629], Lewiston, NY, U.S.A.
This Book is in Good Condition. Clean Copy With Light Amount of Wear. 100% Guaranteed. Summary: Thermodynamics and Phase Diagrams of Lead-Free Solder Materials.- Phase Diagrams of Pb-Free Solders and their Related Materials Systems.- The Effects of Suppressed Beta Tin Nucleation on the Microstructural Evolution of Lead-Free Solder Joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-free Electronic Solder Applications.- Rare Earth Additions to Lead-Free electronic solders.- Compression Stress-Strain and Creep Properties of the 52In-48Sn and 97In-3Ag Low Temperature Pb-Free Solders.- Sn-Zn Low Temperature Solders.- Composite Lead-Free Electronic Solders.- Processing and Material Processing Issues Related to Lead-free Soldering.- Interfacial Reaction Issues for Lead-Free Electronic Solders.- Deformation Behavior of Tin and some Tin Alloys.- Microstructure-Based Modeling of Deformation in Sn-Rich (Pb-free) Solder Alloys.- Mechanical Fatigue of Sn-rich Pb-free Solder Alloys.- Life Expectancies of Pb-free SAC Solder Interconnects in Electronic Hardware.- Studies dealing with Sn-based solder joint behavior under thermal excursions encountered in service environments.- Electromigration Statistics and Damage Evolution for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages.- Electomigration Issues in Lead-Free Solder Joints.- Stress Analysis of Spontaneous Sn Whisker Growth.- Whisker Growth Issues.- Tin Pest Issues in Lead-Free Electronic Solders.- Issues Related to the Implementation of Pb-free Electronic Solders in Consumer Electronics.- Impact of the ROHS Directive on High Performance Electronic Systems: Part I-Need for Lead Utilization in Exempt Systems, Part II-Key Reliability issues Preventing the Implementation of Lead-Free Solders.
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Lead-free Electronic Solders: A Special Issue of the Journal of Materials Science, Materials in Electronics (Hardback) (2007)
EN HC NW RPISBN: 9780387484310 bzw. 0387484310, in Englisch, Springer-Verlag New York Inc., United States, gebundenes Buch, neu, Nachdruck.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Versandkostenfrei.
Von Händler/Antiquariat, The Book Depository US [58762574], London, United Kingdom.
Language: English Brand New Book ***** Print on Demand *****. Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Von Händler/Antiquariat, The Book Depository US [58762574], London, United Kingdom.
Language: English Brand New Book ***** Print on Demand *****. Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
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Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics
EN USISBN: 9780387484310 bzw. 0387484310, in Englisch, Springer US, Springer US, Springer US, gebraucht.
Lieferung aus: Vereinigte Staaten von Amerika, zzgl. Versandkosten, Free Shipping on eligible orders over $25.
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns, elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, until recently, solders used in electronics, based on suitability and knowledge-base developed over a long period of time, remained lead-based. Successive rapid advances in microelectronic devices in recent decades make them obsolete within a very short period after their introduction resulting in significant quantities of electronic wastes in landfills. Leaching of toxic lead from such electronic wastes can result in contamination of the human food chain causing serious health hazards. As a consequence, several European and Pacific Rim countries have passed legislations warranting elimination of lead from electronic solders by fast approaching deadlines. Global economic pressures brought on by such legislations have resulted in a flurry of research activities to find suitable lead-free substitutes for the traditional leaded electronic solders. The worldwide multi-faceted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in this area. So it becomes essential to have most of the relevant and currently available information in a single source. With this goal in mind, the important issues that are encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas, were invited to write articles on those topics. They.
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns, elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, until recently, solders used in electronics, based on suitability and knowledge-base developed over a long period of time, remained lead-based. Successive rapid advances in microelectronic devices in recent decades make them obsolete within a very short period after their introduction resulting in significant quantities of electronic wastes in landfills. Leaching of toxic lead from such electronic wastes can result in contamination of the human food chain causing serious health hazards. As a consequence, several European and Pacific Rim countries have passed legislations warranting elimination of lead from electronic solders by fast approaching deadlines. Global economic pressures brought on by such legislations have resulted in a flurry of research activities to find suitable lead-free substitutes for the traditional leaded electronic solders. The worldwide multi-faceted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in this area. So it becomes essential to have most of the relevant and currently available information in a single source. With this goal in mind, the important issues that are encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas, were invited to write articles on those topics. They.
4
Lead-Free Electronic Solders - A Special Issue of the Journal of Materials Science: Materials in Electronics
EN NW EB DLISBN: 9780387484334 bzw. 0387484337, in Englisch, Springer-Verlag, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, E-Book zum Download.
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so. The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications). This material Orig.
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so. The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications). This material Orig.
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Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics
EN NWISBN: 9780387484310 bzw. 0387484310, in Englisch, Springer, Deutschland, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Versandkostenfrei.
Von Händler/Antiquariat, Romtrade Corp. [59069402], Sterling Heights, MI, U.S.A.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, Romtrade Corp. [59069402], Sterling Heights, MI, U.S.A.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
7
Lead-Free Electronic Solders
EN NW EBISBN: 9780387484334 bzw. 0387484337, in Englisch, Springer Nature, neu, E-Book.
Lieferung aus: Vereinigte Staaten von Amerika, In Stock.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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