Erweiterte Suche
Wir suchen aus über 100 Shops für Sie jetzt die besten Angebote - bitte etwas Geduld…
- Versandkosten nach Deutschland (ändern auf AUT, CHE, NLD, SWE, DEN, RUS, FRA, POL, CZE, GBR, USA)
Voreinstellungen anlegen

Alle Bücher für 9780080540269 - jedes Angebot vergleichen

9780080540269 - H. Fukuda: Rapid Thermal Processing for Future Semiconductor Devices - Buch
1
H. Fukuda (?):

Rapid Thermal Processing for Future Semiconductor Devices (2003) (?)

Lieferung erfolgt aus/von: Niederlande

ISBN: 9780080540269 (?) bzw. 0080540260, in Englisch, Elsevier Science, neu, E-Book

106,48(unverbindlich)
Direct beschikbaar
bol.com
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V com... This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas such as: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies. Productinformatie:Taal: Engels;Formaat: ePub met kopieerbeveiliging (DRM) van Adobe;Bestandsgrootte: 7.54 MB;Kopieerrechten: Het kopiëren van (delen van) de pagina's is niet toegestaan ;Printrechten: Het printen van de pagina's is niet toegestaan;Voorleesfunctie: De voorleesfunctie is uitgeschakeld;Geschikt voor: Alle e-readers te koop bij bol.com (of compatible met Adobe DRM). Telefoons/tablets met Google Android (1.6 of hoger) voorzien van bol.com boekenbol app. PC en Mac met Adobe reader software;ISBN10: 0080540260;ISBN13: 9780080540269; Engels | Ebook | 2003
Kommentar des Händlers/Antiquariats bol.com:
Nieuw, Direct beschikbaar
Bestellnummer bei der Plattform Bol.com: 1001004007056938
Kategorie: School en studie, Techniek en technologie, Elektronica /, School en studie, Exacte wetenschappen, Natuurkunde
Daten vom 09.06.2016 11:11h
ISBN (andere Schreibweisen): 0-08-054026-0, 978-0-08-054026-9
9780080540269 - H. Fukuda: Rapid Thermal Processing for Future Semiconductor Devices - Buch
2
H. Fukuda (?):

Rapid Thermal Processing for Future Semiconductor Devices (?)

ISBN: 9780080540269 (?) bzw. 0080540260, in Deutsch, Pergamon; Pergamon Press, Vereinigte Staaten von Amerika, neu, E-Book

133,93(unverbindlich)
zzgl. Versandkosten, Sofort per Download lieferbar
Von Händler/Antiquariat
Rapid Thermal Processing for Future Semiconductor Devices, This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Bestellnummer des Händlers: 29700877
Bestellnummer bei der Plattform Buch.de: 1998cc282c730ed64e0428c8d1f63f ab
Kategorie: eBooks / Fremdsprachige eBooks / Englische eBooks / Sach- & Fachthemen / Physik
Schlüsselwörter: eBooks
Daten vom 09.06.2016 11:11h
ISBN (andere Schreibweisen): 0-08-054026-0, 978-0-08-054026-9

9780080540269

Finden Sie alle lieferbaren Bücher zur ISBN-Nummer 9780080540269 einfach und schnell und können die Preise vergleichen und sofort bestellen.

Lieferbare Raritäten, Sonderausgaben, Restposten und gebrauchte Bücher sowie antiquarische Bücher des Titels "Rapid Thermal Processing for Future Semiconductor Devices" von H. Fukuda werden vollständig erfasst.

Benachbarte Bücher

>> zum Archiv