Lumineszenz-Imaging Anwendungen in industrieller Fertigungsumgebung von Silicium-Solarzellen.
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Preise | Apr. 16 | Dez. 16 | Apr. 19 | Okt. 19 |
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Schnitt | € 49,00 | € 49,00 | € 49,23 | € 58,50 |
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Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells. (2015)
~EN PB NW
ISBN: 9783839609392 bzw. 3839609399, vermutlich in Englisch, Fraunhofer Verlag Dez 2015, Taschenbuch, neu.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
Neuware - A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation between fine contact finger geometry and rheological parameters of the printing pastes enabled the reduction of the total silver consumption to 15 mg/cell front side. 287 pp. Englisch.
Neuware - A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation between fine contact finger geometry and rheological parameters of the printing pastes enabled the reduction of the total silver consumption to 15 mg/cell front side. 287 pp. Englisch.
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/ | Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells. | Fraunhofer IRB | 2015
~EN NW
ISBN: 9783839609392 bzw. 3839609399, vermutlich in Englisch, Fraunhofer IRB, neu.
A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation between fine contact finger geometry and rheological parameters of the printing pastes enabled the reduction of the total silver consumption to < 15 mg/cell front side.
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Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells.
~EN NW
ISBN: 9783839609392 bzw. 3839609399, vermutlich in Englisch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Lieferzeit: 11 Tage, zzgl. Versandkosten.
A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation between fine contact finger geometry and rheological parameters of the printing pastes enabled the reduction of the total silver consumption to < 15 mg/cell front side.
A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation between fine contact finger geometry and rheological parameters of the printing pastes enabled the reduction of the total silver consumption to < 15 mg/cell front side.
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Gebr. - Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells. (Solar Energy and Systems Research) (2015)
~EN PB NW
ISBN: 9783839609392 bzw. 3839609399, vermutlich in Englisch, Taschenbuch, neu.
Lieferung aus: Deutschland, 01-3 Tage.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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Plated Copper Front Side Metallization (2015)
~EN PB NW
ISBN: 9783839609392 bzw. 3839609399, vermutlich in Englisch, Taschenbuch, neu.
Lieferung aus: Deutschland, Next Day, Versandkostenfrei.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells. (2015)
~EN NW
ISBN: 3839609399 bzw. 9783839609392, vermutlich in Englisch, Fraunhofer Verlag, neu.
Von Händler/Antiquariat, MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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