Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.
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Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts. (2015)
DE PB NW
ISBN: 9783839609163 bzw. 383960916X, in Deutsch, Fraunhofer Verlag Sep 2015, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, Agrios-Buch [57449362], Bergisch Gladbach, Germany.
Neuware - The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. 195 pp. Englisch.
Von Händler/Antiquariat, Agrios-Buch [57449362], Bergisch Gladbach, Germany.
Neuware - The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. 195 pp. Englisch.
2
Symbolbild
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts. (2015)
DE PB NW
ISBN: 9783839609163 bzw. 383960916X, in Deutsch, Fraunhofer Verlag Sep 2015, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, sparbuchladen [52968077], Göttingen, Germany.
Neuware - The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. 195 pp. Englisch.
Von Händler/Antiquariat, sparbuchladen [52968077], Göttingen, Germany.
Neuware - The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. 195 pp. Englisch.
3
/ | Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts. | Fraunhofer
~EN NW
ISBN: 9783839609163 bzw. 383960916X, vermutlich in Englisch, Fraunhofer IRB, neu.
The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential.
4
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.
~EN NW AB
ISBN: 9783839609163 bzw. 383960916X, vermutlich in Englisch, neu, Hörbuch.
Lieferung aus: Österreich, Lieferzeit: 5 Tage, zzgl. Versandkosten.
The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential.
The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential.
5
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.
~EN PB NW
ISBN: 9783839609163 bzw. 383960916X, vermutlich in Englisch, Fraunhofer Verlag, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.: The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. Englisch, Taschenbuch.
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.: The combination of localized laser patterning and metal plating allows to replace conventional silver screen printing with nickel-copper plating to form inexpensive front contacts for crystalline silicon solar cells. In this work, a focus is put on effects that could cause inhomogeneous metal deposition and low metal contact adhesion. A descriptive model of the silicon nitride ablation mechanism is derived from SEM imaging and a precise recombination analysis using QSSPC measurements. Surface sensitive XPS measurements are conducted to prove the existence of a parasitic surface layer, identified as SiOxNy. The dense SiOxNy layer is an effective diffusion barrier, hindering the formation of a nickel silicide interlayer. After removal of the SiOxNy layer, cells show severe degradation caused by metal-induced shunting. These shunts are imaged using reverse biased electroluminescence imaging. A shunting mechanism is proposed and experimentally verified. New laser process sequences are devised and proven to produce cells with adhering Ni-Cu contacts. Conclusively the developed processes are assessed based on their industrial feasibility as well as on their efficiency potential. Englisch, Taschenbuch.
6
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.
~EN PB NW
ISBN: 383960916X bzw. 9783839609163, vermutlich in Englisch, Fraunhofer Verlag, Taschenbuch, neu.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
7
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts.
~EN NW
ISBN: 383960916X bzw. 9783839609163, vermutlich in Englisch, neu.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
8
Characterization of Laser Doped Silicon (2015)
~EN PB NW
ISBN: 9783839609163 bzw. 383960916X, vermutlich in Englisch, Taschenbuch, neu.
Lieferung aus: Deutschland, Next Day, Versandkostenfrei.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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